| − | To help dissipate a processor's heat, it usually will have a [[heat sink]], which is usually a [[metal]] object with fins or pins extending out into the air to heat the air and cool the heat sink. When one piece of metal is pressed firmly against another, heat can exchange fairly easily. However, imperfections in the two surfaces reduce the transfer rate. Heat can be transferred across such gaps, but not in an efficient manner,<ref>http://www.hardwaresecrets.com/how-to-correctly-apply-thermal-paste/2</ref> since air has a high [[specific heat]]. For this reason, a filler substance is used in between these two surfaces. There are multiple kinds of filler material, but thermal grease is perhaps the most common type. | + | To help dissipate a processor's heat, it usually will have a [[heat sink]], which is usually a [[metal]] object with fins or pins extending out into the air to heat the air and cool the heat sink. When one piece of metal is pressed firmly against another, heat can exchange fairly easily. However, imperfections in the two surfaces reduce the transfer rate. Heat can be transferred across such gaps, but not in an efficient manner,<ref>http://www.hardwaresecrets.com/how-to-correctly-apply-thermal-paste/2</ref> since air has an extremely low thermal conductivity. For this reason, a filler substance is used in between these two surfaces. There are multiple kinds of filler material, but thermal grease is perhaps the most common type. |