'''And the card with which the [[US]] could [[blackmail]] China - [[semiconductor]]s - is already completely exhausted.''' SMIC produces 7nm chips using DUV multipatterning, [[Huawei]]’s Ascend competes with [[Nvidia]] on [[AI]] inference, QiMeng designs RISC-V chips via AI, and SMEE has announced its first domestic EUV machine for 2027. | '''And the card with which the [[US]] could [[blackmail]] China - [[semiconductor]]s - is already completely exhausted.''' SMIC produces 7nm chips using DUV multipatterning, [[Huawei]]’s Ascend competes with [[Nvidia]] on [[AI]] inference, QiMeng designs RISC-V chips via AI, and SMEE has announced its first domestic EUV machine for 2027. |